Aviatech’s High-Precision,
High-Reliability PCBA Solutions

Advanced PCB Assembly Infrastructure at Verna, Goa – Designed for Defence, Aerospace and Regulated Industrial Applications

About the Facility

Located at Plot No. S 80-81, Verna Industrial Estate, Goa, Aviatech’s PCB Assembly facility represents the evolution of the company from defence MRO services to advanced Electronic Manufacturing Services (EMS).

Built to serve high-reliability electronics programmes, the facility supports defence and select civil applications including aerospace, maritime systems, industrial electronics and regulated technology platforms.

This facility is not just an expansion – it is a Strategic Technology Hub designed to support India’s growing need for indigenous, high-precision electronic manufacturing capability.

Precision Engineered SMT Production

The unit operates a synchronized Surface Mount Technology (SMT) production line designed for high-accuracy placement and inspection.

Machine Infrastructure

Panasonic NPM-W2

High-speed placement with micro-component readiness down to 03015

PARMI Xceed Optima L

Full 3D Automated Optical Inspection (AOI) system

SONIC & YJLink Systems

Synchronized automation using SONIC and YJLink systems

Technical Specifications

  • • PCB Size Range: 80 mm × 80 mm to 460 mm × 460 mm
  • PCB Thickness: 0.4 mm to 8 mm
  • Edge Clearance: 3–5 mm
  • Advanced Components: Micro-BGA, CSP, QFN, Ultra-Fine Pitch components

Core Capabilities

Micro-Component Precision

The line is micro-component ready, capable of handling chips as small as 0.4 mm, enabling high-density, next-generation electronic assemblies.

Large Board Versatility

Supports boards up to 460 mm × 460 mm, accommodating compact modules as well as large aerospace or industrial control assemblies.

Advanced Component Handling

Specialization in complex packages including Micro-BGA, CSP (Chip Scale Package), QFN (Quad Flat No-leads) and ultra-fine pitch components.

Quality Assurance & Inspection

3D Solder Paste Inspection (SPI)

Ensures precise solder deposition prior to placement.

Full 3D AOI

The PARMI Xceed Optima L system performs complete 3D solder joint validation, detecting defects beyond traditional 2D systems.

Full Traceability

Component-level traceability compliant with defence and ISO 13485-level regulated project requirements.

Beyond PCBA – Integrated Support Infrastructure

Controlled Environment Test Chamber for Line Replaceable Units (LRUs)

RF Shield Box / Anechoic Chamber for airborne radar performance checks

NABL (ISO 17025) accredited calibration lab

Engineering collaboration for DFM (Design for Manufacturability)

Rapid Prototyping & NPI (New Product Introduction)

Obsolescence management and legacy PCB cloning for defence platforms

Why Aviatech?

  • Backed by 40+ years of Crown Defence engineering heritage
  • Authorized partner for global defence OEMs
  • ISO 9001 certified MRO service provider
  • High-Mix, Low-Volume (HMLV) specialization
  • Defence-grade process control with scalable production capability

Contact

For PCB Assembly enquiries: aviatech.goa@aviatechindia.com

AEPL is an Aviation MRO organisation and is setting up the facilities under the ‘Make in India’ policy of Government of India to provide MRO and Logistic support to Global standards to the Indian Military Aviation.