Industrial Electronics
High-mix manufacturing support for controls, instrumentation, power, communication and specialised industrial products.
From prototypes and New Product Introduction to repeatable low- and medium-volume production, Aviatech provides engineering-led PCB assembly from its facility in Goa, India.
Built for projects where manufacturability, process control, traceability and a clearly defined inspection and test plan matter.
Prototype Builds | NPI Support | High-Mix Production | Programme-Specific Verification
40+ Years of
Engineering Heritage
High-Mix,
Low-Volume Focus
DFM and
NPI Support
3D Automated
Optical Inspection
Test Plan Defined
per Programme
Aviatech Enterprises Pvt. Ltd. supports specialised electronics programmes where a successful build depends on more than placement speed or a price per board.
Our PCBA facility at Verna, Goa, combines automated SMT production and 3D Automated Optical Inspection with Aviatech’s wider experience in engineering, aviation MRO, calibration, testing, reverse engineering, obsolescence management and indigenisation.
We work with OEMs, engineering companies, product-development teams and specialised electronics businesses that require responsive engineering coordination, controlled revisions and an inspection and testing approach matched to the product risk.
Suitability for high-reliability, regulated or safety-critical applications is confirmed only after review of the customer’s technical requirements, applicable quality-system requirements and required test coverage.
Prototype and engineering builds
New Product Introduction and pilot runs
High-mix, low-to-medium-volume PCB assemblies
Industrial control, instrumentation and test equipment
Communication, RF and specialised electronic systems
Maritime and defence-support electronics
Legacy PCB replacement and indigenisation projects
Customer-controlled builds with defined acceptance and test requirements
Mission-critical defence, flight-critical aerospace, regulated medical and other safety-critical products are considered only after confirmation of the required quality-system scope, inspection method, test coverage, qualification evidence and customer approval.
Convert your design into an assembled prototype for engineering validation and further development.
Move from a working prototype to a controlled and repeatable manufacturing process.
Manufacturing support for specialised products involving multiple board variants and lower production quantities.
Engineering and manufacturing support for ageing, obsolete, imported or difficult-to-source PCB assemblies.
High-mix manufacturing support for controls, instrumentation, power, communication and specialised industrial products.
Prototype, NPI and production support for specialised test, calibration and engineering equipment.
Selected systems, sub-systems, test equipment, legacy support and indigenisation programmes subject to programme qualification.
Selected engineering, ground-support, MRO-support and non-flight-critical requirements subject to technical and quality review.
A synchronised SMT line supports repeatable component placement across prototype, NPI and production requirements.
Placement of miniaturised components, including 03015-class components, is subject to component, board, stencil, process and inspection review.
Micro-BGA, CSP, QFN, LGA and other bottom-terminated or fine-pitch packages are accepted only after manufacturability and inspection-plan review.
PARMI Xceed Optima L 3D AOI supports inspection of component presence, alignment, polarity, dimensional conditions and visible solder-joint defects.
Electrical or node-level testing may be applied where the board design, test access and validated test programme permit. Test coverage is stated for the specific project.
Engineering review helps identify manufacturing and test-access risks before production.
Customers can transition from design to a controlled production process with documented revisions and agreed inspection stages.
Lot, component, production and test records can be provided according to the agreed project scope and quality plan.
No Single Inspection Method Proves a Complete PCBA. Aviatech defines the appropriate inspection and test route after reviewing the product design, component packages, test access, application risk and customer acceptance criteria.
Design, package, access and documentation review.
Stencil, placement, reflow, handling and revision controls agreed.
Inspection of placement, polarity, dimensional and visible solder conditions.
Applied where supported by design and a validated test programme.
X-ray or specialist inspection through a qualified partner when required.
Functional, RF, environmental or other agreed testing.
Results linked to agreed lot, serial-number or batch records.
Specialised testing: Specialised tests may be performed by qualified external partners. The quotation and quality plan should identify which activities are in-house and which are externally provided.
For prototypes and lower-risk builds where the customer accepts visual and 3D AOI verification.
For boards requiring AOI plus validated node, continuity or electrical checks.
For higher-reliability programmes requiring a tailored mix of internal and partner-provided verification.
| Parameter | Capability |
|---|---|
| PCB size range | 70 mm × 50 mm to 510 mm × 510 mm |
| PCB thickness | 0.4 mm to 8 mm |
| Required edge clearance | 3 mm to 5 mm |
| Micro-component capability | Down to 03015-class components, subject to process and inspection review. |
| Advanced packages | Micro-BGA, CSP, QFN, LGA and ultra-fine-pitch components, subject to package-specific review. |
| Placement system | Panasonic NPM-W2 |
| Inspection system | PARMI Xceed Optima L 3D AOI |
| Electrical / node testing | Available only where design access and a validated programme permit; coverage confirmed per project. |
| Specialised inspection | External-partner X-ray and other specialist testing may be coordinated when required. |
| Production model | Prototype, NPI, high-mix low-volume and low-to-medium-volume support. |
| Facility location | Verna Industrial Estate, Goa, India |
The unit operates a synchronized Surface Mount Technology (SMT) production line designed for high-accuracy placement and inspection.
Automated component placement supporting complex and high-mix PCB assemblies, subject to machine and process review.
3D Automated Optical Inspection supporting component and visible solder-condition inspection, measurement and production-process control.
Important public note: AOI does not provide complete inspection of every hidden joint beneath BGA, CSP, LGA or QFN packages. Where hidden-joint inspection is required, the inspection route is defined separately.
Synchronised automation supporting material movement and production flow across the SMT line.
Where the programme requires X-ray, flying-probe, advanced electrical, cleanliness, destructive analysis or other specialist verification beyond the current in-house scope, Aviatech may coordinate the activity through a qualified external partner with customer approval.
Aviatech’s wider engineering infrastructure allows customers to discuss requirements extending beyond placement and AOI.
The applicability, scope, accreditation status and location of each service are confirmed in the proposal and programme quality plan.
Discuss Your Testing RequirementThe requirement is assessed as a manufacturing and verification programme, not only as a placement job.
The operating model is intended for specialised products, multiple board variants and lower production quantities.
The proposal should state what is inspected, what is tested, the expected coverage and which activities are external.
Aviatech brings established engineering and MRO experience; certification scope is represented accurately.
Specialist inspection can be added without representing outsourced equipment as in-house capability.
Obsolescence, cloning, revision control and indigenisation experience support products expected to remain operational for years.
For the fastest and most accurate review, provide as many of the following as are available:
Prototype, NPI, high-mix and low-to-medium-volume PCB assembly for specialised electronics. Each project is reviewed for fit, inspection requirements and available test coverage.
These packages may be assembled subject to design and process review. AOI verifies visible conditions; hidden-joint inspection, such as X-ray, is defined separately when required.
No. The proposal should clearly identify which activities are performed in-house and which may be coordinated through a qualified external partner.
Electrical or node testing may be provided where the board design offers adequate access and a validated test programme can be established. The test coverage is stated for the specific project.
Functional-test support is reviewed case by case. It may use a customer-supplied fixture and procedure, a jointly developed fixture, or an approved external specialist.
Selected defence-support, development, legacy and indigenisation requirements may be considered. Mission-critical or safety-critical programmes require customer-specific qualification and confirmation of the required QMS and test scope.
Medical or regulated enquiries may be reviewed, but acceptance depends on the customer’s regulatory requirements, the applicable QMS certification scope and the required process validation. No ISO 13485 manufacturing claim should be inferred unless explicitly confirmed.
Where available: BOM, Gerber/ODB++, pick-and-place, drawings, schematic, package list, quantities, acceptance standard, inspection/test requirements and delivery date.
Yes. Submit what is available. Aviatech will identify missing inputs before manufacturability, test coverage or pricing is confirmed.
Verna Industrial Estate, Goa, India. Use the approved full address and contact details in the final page footer.
Tell us about your prototype, NPI, production, legacy or indigenisation requirement. We will review the manufacturing scope and the inspection and test route needed for your programme.